Machine Capability Enhancement to Address Lacking Epoxy Coverage during Die Attach Process of QFN Packages

Epoxy coverage on die attach process is one of the important characteristics of a QFN semiconductor product. Epoxy condition on a die contributes to the product performance physically and electrically. Complete epoxy coverage satisfies the manufacturing requirement and resulting to customer’s confidence. As the products becomes complex and innovative, certain difficulties are met on the production line. Incomplete epoxy coverage caused by epoxy hardening cannot be prevented as minor machine aid and other unscheduled machine idle time are present. This manuscript will discuss and focus on how to address the said phenomenon by automation principle and augmented process with the idea of industry 4.0.